With the rapid development of electronic assembly technology, the difficulty of SMT inspection technology and equipment has increased. At the same time, the competition has become increasingly fierce. Different inspection technologies are used for different components. Commonly used are manual visual inspection, flying probe test, and online optical inspection. , X-ray detection, etc., each detection method has its own advantages and disadvantages.

visual inspection

Visual inspection is to confirm whether the product meets the standard through manual observation with the naked eye. It is widely used because of its convenient operation and low cost. It is closely related to the experience and work attitude of the staff.

AOI

AOI testing, by utilizing high-speed and high-precision optical process technology to detect defects, quickly acquire inspection target images, compare them with the appropriate parameters that have been restored in the database, find out PCB defects and automatically mark them through the monitor, the advantages of the method are convenient Programming learning, simple operation, AOI cannot detect the structure of components without solder joints, and cannot display unobvious defects such as components and PCB warpage.

ICT

ICT equipment includes flying probe testers and bed of nails testers, and the test targets are generally modules assembled by SMT. The electrical performance of the components on the PCB is tested by ICT, and the defects include missing parts, wrong parts, defective parts, short circuits, open circuits and assembly defects, etc.

X-ray inspection

Through the penetration of X-rays, the welding quality can be clearly reflected. X-ray inspection can reveal more solder joint sizes than AOI, but at a higher cost.

In the face of these problems, the development trend of SMT inspection technology:

1. Intelligence:

Use intelligent algorithms and machine learning technologies to improve detection efficiency and accuracy, and solve problems such as misjudgments in some AI detections.

2. Integration:

Break the traditional scattered and independent status of various testing equipment, integrate different testing technologies together to form a complete SMT production line system.

In order to help enterprises quickly reduce costs and increase efficiency, achieve rapid mass production, increase volume and increase growth, Future Att will independently develop and produce intelligent testing equipment  to make electronic component material management more efficient and convenient.

Future Att's X-RAY intelligent detection equipment 

  1. X-ray automatic pointing machine  

Compatible with 7-15 inch trays, supports mixed feeding of multiple trays, meets the needs of various scenarios, intelligent operations such as automatic loading, labeling, unloading, and review of the entire process, and is equipped with NG channels to prevent unqualified materials from The flow out of the channel port ensures that the materials are accurate and realizes the precise management of materials at the line.

  2. x-ray intelligent pointing machine (double station)  

Compatible with 7-15 inch material trays, set double-station mode, the system quickly reads codes, counts materials, one in and one out, counts materials when preparing materials, and works in turns to improve work efficiency, and does not require on-site modification, enabling rapid deployment , Flexible docking production.

  3. x-ray intelligent pointing machine (single station)  

Compatible with 7-15 inch trays, adopts single-station mode, automatic scanning, code reading, label generation, fool-proof and error-proof mechanism throughout the process, no need to modify the site, can achieve rapid deployment, and has the characteristics of high precision and high efficiency.

The application of SMT detection technology not only covers 3c electronics, automobiles, new energy, aerospace and other major fields, but it is also changing human production and life in a new way.